Production Operator x 2

Reference:
15537
Markets:
Division:
Salary:
Per Annum

Job description

Purpose of Role

Assembly of RF and Microwave electronic components and /or electro-mechanical assemblies through various process stages, working to defined build procedures and standards in order to meet clearly identified targets.

Main Responsibilities

  • Assembly of electronic devices using a range of manufacturing tools and equipment, some under high magnification.
  • Work to clearly defined goals with respect to quality, output and timescale.  
  • Attend departmental meetings as required & maintain all documentation and records as requested
  • Being flexible between processes where appropriate training has been given.  
  • Identify opportunities for continuous improvement and cost reduction
  • Provide timely feedback to supervisor / manager on any technical or quality issues that arise
  • Ensure all work & time is recorded appropriately through the CATS /PDC system
  • Assist with any Lean Six Sigma initiatives as required
  • Assist in the training of new personnel as required
  • Observe general housekeeping rules and maintain a clean and tidy working environment at all times
  • Ensure that all Environmental Health and Safety / Company Policies are adhered to at all times
  • Assistance in other departments in order to meet Company objectives. 
  • Capable of reading and understanding information contained within job travellers to assure that all requirements or special instructions applicable to the job are met.
  • Capable of following traveller, layout, and wire bond according to customers specifications.
  • Responsible for machine set and verification of the machine parameters to ensure that they are within the correct specifications
  • Responsible for use of thermocouple settings to verify work holders and bond tip temperatures and able to make adjustments within required specifications.
  • Able to check for tool damage or defectiveness in machine peripherals
  • Able to set up for new product. Including bond, dispense and placement coordinates, loop profiles and bonding conditions.
  • Debug and resolve basic process issues like non-sticking/lifting

Key Competencies

  • Ability to work as part of a team
  • Good manual dexterity
  • Ability to work under a microscope and under minimum supervision
  • Basic computer knowledge desirable & good communication skills

Previous and Relevant Experience

  • Previous experience in a similar role within an electronics environment preferred
  • Wire bond process experience ball & wedge required.
  • Auto Bonding (wedge/wedge) and Pick and Place experience required.
  • Experience with Hesse Knipps auto wire bonders required
  • Experience with Datacon pick & place desired

Education

GCSE in Maths and English preferred

Note:     This job description summarizes the main aspects of the job, but does not cover all the duties that the jobholder may be required to perform.

 

Thank you for your interest in this position. It is with regret that we are unable to respond personally to each individual application due to the high volume of CVs we receive on a daily basis. However, your CV and application for this role will be reviewed by one of our qualified consultants within the next 48 hours. If you do not hear from us within this time period, you have unfortunately been unsuccessful on this occasion.

We hope you will apply for future roles that we advertise regularly on this website. However, to keep up to date with all our recruitment activity, please follow us on Twitter, like us on Facebook and check out our vacancy page on our website.

Smart Moves Recruitment is an Equal Opportunities Employer and welcome applications from all suitably qualified persons regardless of their race, sex, disability, religion/belief, sexual orientation or age.

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Smart Moves
51 Clarendon Road,
Radius House First Floor,
Watford, Hertfordshire,
WD17 1HP

Tel: 01908 308788
Fax: 01908 308780
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